TSMC

Some of the key events about TSMC

• 1987

  Founded as the world's first dedicated semiconductor foundry
• 1987

  Faced criticism for potentially transferring sensitive semiconductor technology to mainland China
• 1994

  Became the first foundry to produce 0.35-micron technology
• 1999

  Introduced copper interconnect technology into volume production
• 1999

  Experienced production delays and yield issues with its 0.18-micron process technology
• 2002

  Launched the industry's first 300mm wafer fabrication facility
• 2002

  Suffered financial losses due to a global semiconductor industry downturn
• 2004

  Began volume production of 90nm process technology
• 2005

  Encountered challenges in ramping up 90nm chip production, causing delays for customers
• 2007

  Started mass production using 45nm process technology
• 2009

  Struggled with low capacity utilization during the global financial crisis
• 2011

  Commenced volume production of 28nm technology
• 2013

  Faced a lawsuit from GlobalFoundries over alleged patent infringement
• 2015

  Announced plans to build the world's first 5nm fab
• 2015

  Experienced a data breach that compromised sensitive customer information
• 2018

  Began volume production of 7nm process technology
• 2018

  Suffered production disruptions due to a computer virus attack on its systems
• 2020

  Started volume production of 5nm process technology
• 2020

  Halted new orders from Huawei due to U.S. export restrictions, losing a major customer
• 2021

  Faced criticism for prioritizing automotive chip production during the global chip shortage

Disclaimer: This material is written based on information taken from open sources, including Wikipedia, news media, podcasts, and other public sources.