TSMC
Some of the key events about TSMC
- 1987Founded as the world's first dedicated semiconductor foundry
- 1987Faced criticism for potentially transferring sensitive semiconductor technology to mainland China
- 1994Became the first foundry to produce 0.35-micron technology
- 1999Introduced copper interconnect technology into volume production
- 1999Experienced production delays and yield issues with its 0.18-micron process technology
- 2002Launched the industry's first 300mm wafer fabrication facility
- 2002Suffered financial losses due to a global semiconductor industry downturn
- 2004Began volume production of 90nm process technology
- 2005Encountered challenges in ramping up 90nm chip production, causing delays for customers
- 2007Started mass production using 45nm process technology
- 2009Struggled with low capacity utilization during the global financial crisis
- 2011Commenced volume production of 28nm technology
- 2013Faced a lawsuit from GlobalFoundries over alleged patent infringement
- 2015Announced plans to build the world's first 5nm fab
- 2015Experienced a data breach that compromised sensitive customer information
- 2018Began volume production of 7nm process technology
- 2018Suffered production disruptions due to a computer virus attack on its systems
- 2020Started volume production of 5nm process technology
- 2020Halted new orders from Huawei due to U.S. export restrictions, losing a major customer
- 2021Faced criticism for prioritizing automotive chip production during the global chip shortage
Disclaimer: This material is written based on information taken from open sources, including Wikipedia, news media, podcasts, and other public sources.
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